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Title: Engineering: Cornell Quarterly, Vol.28, No.1 (Autumn 1993): The Electronic Packaging Program
Authors: Ober, Christopher K.
Stoffel, Nancy C.
Russell, Michael W.
Kraus, Gerald T.
Giannelis, Emmanuel P.
Li, Che-Yu
Avedisian, C. Thomas
Torrance, Kenneth E.
Krusius, J. Peter
Keywords: Engineering
Cornell University
Electronic Packaging
Thermal Engineering
Computer Packaging
Issue Date: 1993
Publisher: Internet-First University Press
Abstract: IN THIS ISSUE: The Electronic Packaging Program /2 (The ongoing miniaturization of electronic products challenges engineers to find better ways of putting them together.) ... The Importance of Polymers in Packaging /4 (The advantages of polymers make them indispensable in electronic packaging; overcoming their shortcomings makes for challenging research.) ...Spin-On Oxides for Microelectronics /9 (A technique developed for preparing photoresists can be used to make thin films of high-dielectric-constant oxides for capacitors.) ... Thermal Management of Electronic Packages /20 (Electronic circuits can be damaged by the heat they generate, so thermal engineers are on the case.) ... Dependable Connections: Getting the Signal In and Out /14 (Careful testing improves technologies for making reliable connections between dense arrays of very small contacts.) ... Simulating System Constraints in Computer Packaging /26 (A simulation program makes it possible to compare different packaging options without having to build real prototypes.) ... Register /31 (Three new members join the faculty, six retire.) ... Faculty Publications /36
Appears in Collections:Engineering Quarterly

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