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Influence Of Water Vapor Activity During Thermal Annealing Of Sputtered Igzo Tft Devices

dc.contributor.authorChung, Chen-Yangen_US
dc.contributor.chairThompson, Michael Olgaren_US
dc.contributor.committeeMemberKan, Edwin Chihchuanen_US
dc.date.accessioned2013-09-16T16:42:29Z
dc.date.available2018-08-20T06:01:30Z
dc.date.issued2013-08-19en_US
dc.description.abstractThermal annealing of sputtered InGaZnO4 thin films was studied as a function of annealing ambients under controlled partial pressures of oxygen and water vapor. Water vapor is shown to be critical for obtaining high performance devices with performance improving at water vapor levels substantially higher than normally present in air. The optimized performance of non-reactive sputter fabricated IGZO devices was obtained with post-annealing in air with a 4.5 Torr water vapor pressure. We propose that, in the post-annealing process, water vapor plays a key role due to its small size and high diffusivity, compared to molecular oxygen, allowing it to more easily compensate oxygen vacancies in the IGZO matrix. iiien_US
dc.identifier.otherbibid: 8267064
dc.identifier.urihttps://hdl.handle.net/1813/34209
dc.language.isoen_USen_US
dc.subjectIGZOen_US
dc.subjectTFTen_US
dc.subjectdeviceen_US
dc.subjectannealen_US
dc.subjectwater vaporen_US
dc.titleInfluence Of Water Vapor Activity During Thermal Annealing Of Sputtered Igzo Tft Devicesen_US
dc.typedissertation or thesisen_US
thesis.degree.disciplineMaterials Science and Engineering
thesis.degree.grantorCornell Universityen_US
thesis.degree.levelMaster of Science
thesis.degree.nameM.S., Materials Science and Engineering

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