Engineering: Cornell Quarterly, Vol.28, No.1 (Autumn 1993): The Electronic Packaging Program
| dc.contributor.author | Ober, Christopher K. | en_US |
| dc.contributor.author | Stoffel, Nancy C. | en_US |
| dc.contributor.author | Russell, Michael W. | en_US |
| dc.contributor.author | Kraus, Gerald T. | en_US |
| dc.contributor.author | Giannelis, Emmanuel P. | en_US |
| dc.contributor.author | Li, Che-Yu | en_US |
| dc.contributor.author | Avedisian, C. Thomas | en_US |
| dc.contributor.author | Torrance, Kenneth E. | en_US |
| dc.contributor.author | Krusius, J. Peter | en_US |
| dc.contributor.editor | Price, David | en_US |
| dc.date.accessioned | 2005-11-07T16:43:30Z | |
| dc.date.available | 2005-11-07T16:43:30Z | |
| dc.date.issued | 1993 | en_US |
| dc.description.abstract | IN THIS ISSUE: The Electronic Packaging Program /2 (The ongoing miniaturization of electronic products challenges engineers to find better ways of putting them together.) ... The Importance of Polymers in Packaging /4 (The advantages of polymers make them indispensable in electronic packaging; overcoming their shortcomings makes for challenging research.) ...Spin-On Oxides for Microelectronics /9 (A technique developed for preparing photoresists can be used to make thin films of high-dielectric-constant oxides for capacitors.) ... Thermal Management of Electronic Packages /20 (Electronic circuits can be damaged by the heat they generate, so thermal engineers are on the case.) ... Dependable Connections: Getting the Signal In and Out /14 (Careful testing improves technologies for making reliable connections between dense arrays of very small contacts.) ... Simulating System Constraints in Computer Packaging /26 (A simulation program makes it possible to compare different packaging options without having to build real prototypes.) ... Register /31 (Three new members join the faculty, six retire.) ... Faculty Publications /36 | en_US |
| dc.format.extent | 34732724 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | https://hdl.handle.net/1813/2459 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Internet-First University Press | en_US |
| dc.subject | Engineering | en_US |
| dc.subject | Cornell University | en_US |
| dc.subject | Electronic Packaging | en_US |
| dc.subject | Polymers | en_US |
| dc.subject | Oxides | en_US |
| dc.subject | Microelectronics | en_US |
| dc.subject | Thermal Engineering | en_US |
| dc.subject | Computer Packaging | en_US |
| dc.title | Engineering: Cornell Quarterly, Vol.28, No.1 (Autumn 1993): The Electronic Packaging Program | en_US |
| dc.type | periodical | en_US |
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